ald-process-controller

Atomic Layer Deposition skill for conformal thin film deposition with atomic-level thickness control

509 stars

Best use case

ald-process-controller is best used when you need a repeatable AI agent workflow instead of a one-off prompt.

Atomic Layer Deposition skill for conformal thin film deposition with atomic-level thickness control

Teams using ald-process-controller should expect a more consistent output, faster repeated execution, less prompt rewriting.

When to use this skill

  • You want a reusable workflow that can be run more than once with consistent structure.

When not to use this skill

  • You only need a quick one-off answer and do not need a reusable workflow.
  • You cannot install or maintain the underlying files, dependencies, or repository context.

Installation

Claude Code / Cursor / Codex

$curl -o ~/.claude/skills/ald-process-controller/SKILL.md --create-dirs "https://raw.githubusercontent.com/a5c-ai/babysitter/main/library/specializations/domains/science/nanotechnology/skills/ald-process-controller/SKILL.md"

Manual Installation

  1. Download SKILL.md from GitHub
  2. Place it in .claude/skills/ald-process-controller/SKILL.md inside your project
  3. Restart your AI agent — it will auto-discover the skill

How ald-process-controller Compares

Feature / Agentald-process-controllerStandard Approach
Platform SupportNot specifiedLimited / Varies
Context Awareness High Baseline
Installation ComplexityUnknownN/A

Frequently Asked Questions

What does this skill do?

Atomic Layer Deposition skill for conformal thin film deposition with atomic-level thickness control

Where can I find the source code?

You can find the source code on GitHub using the link provided at the top of the page.

SKILL.md Source

# ALD Process Controller

## Purpose

The ALD Process Controller skill provides comprehensive atomic layer deposition process control, enabling conformal thin film growth with atomic-level precision through optimized pulse sequences and in-situ monitoring.

## Capabilities

- Precursor pulse/purge optimization
- Growth per cycle (GPC) characterization
- Film uniformity mapping
- Conformality assessment
- In-situ monitoring integration
- Multi-component film design

## Usage Guidelines

### ALD Process Control

1. **Saturation Studies**
   - Vary pulse times
   - Identify saturation dose
   - Optimize purge times

2. **Process Window**
   - Determine ALD window
   - Optimize temperature
   - Monitor GPC stability

3. **Film Quality**
   - Characterize uniformity
   - Measure conformality
   - Assess impurity levels

## Process Integration

- Thin Film Deposition Process Optimization
- Nanodevice Integration Process Flow

## Input Schema

```json
{
  "material": "string",
  "precursor_a": "string",
  "precursor_b": "string",
  "target_thickness": "number (nm)",
  "substrate": "string",
  "temperature": "number (C)"
}
```

## Output Schema

```json
{
  "optimized_recipe": {
    "precursor_a_pulse": "number (s)",
    "purge_a": "number (s)",
    "precursor_b_pulse": "number (s)",
    "purge_b": "number (s)"
  },
  "gpc": "number (Angstrom/cycle)",
  "cycles_required": "number",
  "uniformity": "number (%)",
  "conformality": "number (% step coverage)"
}
```

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