ald-process-controller
Atomic Layer Deposition skill for conformal thin film deposition with atomic-level thickness control
Best use case
ald-process-controller is best used when you need a repeatable AI agent workflow instead of a one-off prompt.
Atomic Layer Deposition skill for conformal thin film deposition with atomic-level thickness control
Teams using ald-process-controller should expect a more consistent output, faster repeated execution, less prompt rewriting.
When to use this skill
- You want a reusable workflow that can be run more than once with consistent structure.
When not to use this skill
- You only need a quick one-off answer and do not need a reusable workflow.
- You cannot install or maintain the underlying files, dependencies, or repository context.
Installation
Claude Code / Cursor / Codex
Manual Installation
- Download SKILL.md from GitHub
- Place it in
.claude/skills/ald-process-controller/SKILL.mdinside your project - Restart your AI agent — it will auto-discover the skill
How ald-process-controller Compares
| Feature / Agent | ald-process-controller | Standard Approach |
|---|---|---|
| Platform Support | Not specified | Limited / Varies |
| Context Awareness | High | Baseline |
| Installation Complexity | Unknown | N/A |
Frequently Asked Questions
What does this skill do?
Atomic Layer Deposition skill for conformal thin film deposition with atomic-level thickness control
Where can I find the source code?
You can find the source code on GitHub using the link provided at the top of the page.
SKILL.md Source
# ALD Process Controller
## Purpose
The ALD Process Controller skill provides comprehensive atomic layer deposition process control, enabling conformal thin film growth with atomic-level precision through optimized pulse sequences and in-situ monitoring.
## Capabilities
- Precursor pulse/purge optimization
- Growth per cycle (GPC) characterization
- Film uniformity mapping
- Conformality assessment
- In-situ monitoring integration
- Multi-component film design
## Usage Guidelines
### ALD Process Control
1. **Saturation Studies**
- Vary pulse times
- Identify saturation dose
- Optimize purge times
2. **Process Window**
- Determine ALD window
- Optimize temperature
- Monitor GPC stability
3. **Film Quality**
- Characterize uniformity
- Measure conformality
- Assess impurity levels
## Process Integration
- Thin Film Deposition Process Optimization
- Nanodevice Integration Process Flow
## Input Schema
```json
{
"material": "string",
"precursor_a": "string",
"precursor_b": "string",
"target_thickness": "number (nm)",
"substrate": "string",
"temperature": "number (C)"
}
```
## Output Schema
```json
{
"optimized_recipe": {
"precursor_a_pulse": "number (s)",
"purge_a": "number (s)",
"precursor_b_pulse": "number (s)",
"purge_b": "number (s)"
},
"gpc": "number (Angstrom/cycle)",
"cycles_required": "number",
"uniformity": "number (%)",
"conformality": "number (% step coverage)"
}
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