ebl-process-controller
Electron Beam Lithography skill for high-resolution nanopatterning with dose optimization and proximity effect correction
Best use case
ebl-process-controller is best used when you need a repeatable AI agent workflow instead of a one-off prompt.
Electron Beam Lithography skill for high-resolution nanopatterning with dose optimization and proximity effect correction
Teams using ebl-process-controller should expect a more consistent output, faster repeated execution, less prompt rewriting.
When to use this skill
- You want a reusable workflow that can be run more than once with consistent structure.
When not to use this skill
- You only need a quick one-off answer and do not need a reusable workflow.
- You cannot install or maintain the underlying files, dependencies, or repository context.
Installation
Claude Code / Cursor / Codex
Manual Installation
- Download SKILL.md from GitHub
- Place it in
.claude/skills/ebl-process-controller/SKILL.mdinside your project - Restart your AI agent — it will auto-discover the skill
How ebl-process-controller Compares
| Feature / Agent | ebl-process-controller | Standard Approach |
|---|---|---|
| Platform Support | Not specified | Limited / Varies |
| Context Awareness | High | Baseline |
| Installation Complexity | Unknown | N/A |
Frequently Asked Questions
What does this skill do?
Electron Beam Lithography skill for high-resolution nanopatterning with dose optimization and proximity effect correction
Where can I find the source code?
You can find the source code on GitHub using the link provided at the top of the page.
SKILL.md Source
# EBL Process Controller
## Purpose
The EBL Process Controller skill provides comprehensive electron beam lithography process control, enabling high-resolution nanopatterning through dose optimization, proximity effect correction, and critical dimension control.
## Capabilities
- Pattern design and fracturing
- Dose optimization and modulation
- Proximity effect correction (PEC)
- Alignment and overlay control
- Resist processing optimization
- Critical dimension (CD) control
## Usage Guidelines
### EBL Process Control
1. **Pattern Preparation**
- Design in CAD software
- Fracture into write fields
- Apply beam step size
2. **Dose Optimization**
- Run dose matrices
- Apply PEC algorithms
- Account for pattern density
3. **Process Integration**
- Optimize resist thickness
- Control development conditions
- Verify feature dimensions
## Process Integration
- Nanolithography Process Development
- Nanodevice Integration Process Flow
## Input Schema
```json
{
"pattern_file": "string",
"resist": "string",
"thickness": "number (nm)",
"target_cd": "number (nm)",
"beam_voltage": "number (kV)",
"beam_current": "number (pA)"
}
```
## Output Schema
```json
{
"optimized_dose": "number (uC/cm2)",
"pec_parameters": {
"alpha": "number",
"beta": "number",
"eta": "number"
},
"write_time": "number (hours)",
"expected_cd": "number (nm)",
"cd_uniformity": "number (3sigma)"
}
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